The Role of Micro-Soldering Method in the Manufacturing of Micro-Coils

Building a connection between ultra-fine wires is necessary to place the coils in several devices. However, for developing connections between wires, manufacturers previously used to apply two traditional methods- the welding method and the soldering method.

Multiple environmental and physical factors, can make joining the ultra-fine wires challenging. Manufacturers also have to take care of the desired size of micro-coils. To avoid the breaking point of these tiny wires, it is crucial to maintain the ultra-strict tolerance requirements.

To deal with all these challenges and maintain the high quality of the coils, traditional soldering and welding methods are not useful. Micro-coils are small, wire-like structures that are typically used in a variety of different applications.

They are typically made from a variety of different materials, including copper, aluminum, and other conductive metals. These tiny coils can be used in a wide range of applications, including in electrical circuits, as antennas, and in medical devices. Because of their small size, micro-coils are often used in applications where space is at a premium, such as in mobile phones and other compact electronic devices.

Micro-coils:

Micro-coils are produced through the winding or twisting of ultra-fine wires around a core. During the winding process, it is essential to build a connection between two ultra-fine wires.

The welding method involves melting the wire together to build bonding between them after cooling. Whereas the soldering method engages the application of an external metal that has a lower melting point. However, when it comes to building the connection between 9 microns ultra-fine wires, these methods can not provide effective bonding between the wires.

So to try and better understand why the micro-soldering method is crucial for the production of micro-coils, we have to focus on the manufacturing process of micro-coils.

Miniaturized of Micro-coils:

On the other hand, to cope with the increasing demand for miniaturized micro-coils, manufacturers require to use ultra-fine wires for the production of micro-coils. This is because there is a certain challenge for the manufacturers due to size constraints. Ultra-fine wires are also necessary for the preparation of micro-motion controlling systems and advanced positioning systems. However, the use of ultra-fine wires is quite difficult and challenging. Manufacturers can not rely on the traditional methods to handle the ultra-fine wires as there are several drawbacks of these methods.

Traditional Methods:

There are an enormous number of drawbacks associated with traditional methods, such as-

Traditional methods can destroy the ultra-fine wires due to inaccurate heat spreading.
These methods can cause oxidization at the joints and on the wires.
Traditional methods can result in physical strains and degradation, and you will end up having ineffective connections.

Therefore, to get rid of these drawbacks of traditional methods and overcome other challenges, modern manufacturers rely on the innovative micro-soldering method. This method uses thermal compression bonding technology to connect the ultra-fine wires of similar or different materials and diameters. Apart from joining two similar ultra-fine wires, this method is also efficient to build bonding between an ultra-fine wire and another twelve times thicker wire. Even if the wires are made of different materials, thermal compression bonding technology can effectively join them.

The Advantages of Thermal Compression Bonding Technology:

Manufacturers can use the thermal compression bonding method for building different types of connections, such as a) to attach the ultra-fine wires with the tiny copper thermocouples, b) to build metal-to-metal connections in electromagnetic coils, and c) to fix the micro-coil into the support systems using metal plated terminals. Above all, this technology is efficient to build strain-free, highly reliable, and corrosion-free molecular connections.